HARDWARE DESIGN AND DEVELOPMENT

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State-of-the-art design with end-to-end solutions

Sigma provides design and development services on a range of embedded platforms, based on Microprocessors, Digital signal processors, FPGA and associated peripherals.

Our designs leverage the latest technologies, established industry standards and engineering practices to realise robust products with high reliability. We work with popular architectures and product families in close consultation with our customers.

  • Board Level Design

    • Microprocessors, DSP, FPGA, System-on-Chip (SOC)-based boards
    • Memories – as per requirements
    • Communication Interfaces – as per requirements
    • I/O Interfaces – as per requirements
    • Bus Standards – as per requirements
    • Form Factors – as per requirements
  • Engineering Analysis

    • De-rating Analysis, Power Analysis
    • Reliability Prediction (MTBF), as per MIL-HBK-217; Mfr FIT data
    • FMEA Analysis, as per MIL-STD-1629
    • PCB Thermal Analysis
    • PCB High-Frequency Signal Integrity Analysis
  • PCB Design

    • PCB Design as per MIL-STD-275E
    • Multilayer board designs, with dedicated power and ground planes
    • Special PCB Engineering – Flex-rigid, Embedded metal plane, top
    • metal-clad versions
    • Well-established outsourcing with Group-A and Group-B IPC Class-3 certifications
  • FPGA Design

    • Complex digital logic designs
    • Embedded ARM, Power PC, other architectures
    • Verilog and VHDL languages
    • Functional and timing simulation
  • Mechanical Design and Engineering

    • Well-established arrangements for component storage
    • Components stored under controlled environment
    • Clear demarcation of incoming stores, quarantined stores and accepted stores
    • Computerised records
    • Complete records of batch purchase, receipts and issue for traceability
  • Stores 

    • Well-established arrangements for component storage
    • Components stored under controlled environment
    • Clear demarcation of incoming stores, quarantined stores and accepted stores
    • Computerised records
    • Complete records of batch purchase, receipts and issue for traceability
  • PCB Assembly facilities

    • Well-established procedures and guidelines
    • Anti-static work area as per the ANSI S 20.20 Standard
    • Dust, temperature and humidity control
    • Trained and experienced technicians
    • Excellent tools for soldering, re-work and visual inspection
    • In-house facilities for precision component soldering
    • Well-established sources for BGA package soldering
    • Complete sub-system assembly, including mechanical integration, wiring and crimping
    • Stage-wise inspection by QA, as per approved inspection and test plans
  • System and Sub-System Design

    • Quality Planning
    • Complete system / sub-system Design and Engineering
    • Full product qualification, to required standards
    • Mechanical Enclosure / Thermal Engineering
    • Power Supply engineering
  • Procurement and Sourcing

    • Well-established process for purchase and outsourcing
    • Approved Vendor system, with vendor-evaluation, ratings and re-evaluation
    • Identification and sourcing of MIL / industrial grade components
    • Direct procurement of components from manufacturers, distributors and authorized dealers, with certificate of conformance (COC) / test certificates
    • Well-defined acceptance test procedures, inspection and QA, including anti-counterfeit measures
    • Well-established sources for PCB fabrication, with MIL
    • Group-A and Group-B certification/IPC Standards
    • Well-established sources for mechanical fabrication, material sourcing, analysis and treatment

ParticularsMake & StandardsArchitecture
EngineeringCOTS, CustomLRU, ATR 19" rack mount Hand-held, Custom
QualificationDefence, Aerospace, IndustrialIP5X, IP6X, MIL-STD-810, MIL-STD-461, MIL-STD-704, JSS 55555
MicroprocessorsFreescale, Intel, ARM, ST, Texas
Instruments & others
Multi-core & Single-core CPUs
ARM Cortex-A (A5, A7, A8, A9); R (R4, R5); M (MO, M3, M4, M7) ARM 7, 9, 11 RISC-V i.MX, SAM-D, PowerPC Host Architecture QUICC, X86, X86-64, 68K
Digital Signal ProcessorsTexas Instruments, Analog DevicesKey Stone, C6000, C5000,
Tiger SHARC, SHARC, Black Fin
Microcontroller
Digital Signal Controllers
ARM, NXP, Texas Instruments,
Atmel, Microchip
TI C2000, MSP430, PIC, AVR, X51
FPGA, CPLD, EPLDXILINX, Altera, ACTEL, LatticeUltraScale +, Virtex 1-7, Spartan, Stratix, Cyclone FPGA SOC (Hardcore & Softcore)
Mach XO, Xp2, Cool Runner, XC, Xa9500 MAX
MemoriesIndustry StandardsFlash, SRAM, DRAM, DDR, SBSRAM, NVRAM, Serial PROM
BusesIndustry StandardsVPX, VXS, VME, ISA, PCI, PCI-e, Compact PCI, Compact PCI Serial Sigma Custom
Communication InterfacesIndustry StandardsEthernet, USB, CAN, Serial ports - Sync & Async, GPIB, HDLC, SDLC, SPI, RC, RS, ARINC-429, 717, 573, MIL-STD-1553B Current loop, Optical, Wireless
1/0 InterfacesIndustry StandardsAnalog, Discrete, Pulsed, Synchro, Resolver, others
Form FactorsDouble EURO, Extended Double EURO, PC104, custom